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These 5 Chip Stocks Are Riding the AI Fab Spending Wave

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Yahoo Finance

July 11, 2026
These 5 Chip Stocks Are Riding the AI Fab Spending Wave

Intelligence Synthesis

AI-Generated Core Insights

Leading semiconductor equipment companies, including Applied Materials (AMAT), Onto Innovation (ONTO), and Teradyne, are seeing significant growth driven by the 'AI Fab spending wave,' with AMAT forecasting over 30% growth by 2026 and ONTO securing a $240 million HBM agreement.

The AI Infrastructure Gold Rush: Analyzing the Semiconductor Equipment Surge

The current trajectory of the artificial intelligence revolution has shifted from a primary focus on software and large language models (LLMs) to the critical physical infrastructure required to sustain them. This shift is manifesting as an "AI Fab spending wave," where the companies that build the machines that make the chips are becoming as pivotal as the chip designers themselves. The recent financial updates from industry giants like Applied Materials (AMAT), Onto Innovation (ONTO), and Teradyne signal a long-term capital expenditure cycle that extends well into the late 2020s.

Applied Materials and the Long-Term Growth Horizon

Gary Dickerson, CEO of Applied Materials, has raised the company's 2026 semiconductor equipment growth forecast to exceed 30%. This is a staggeringly bullish projection for a company of AMAT's scale. To understand the weight of this forecast, one must recognize that AMAT provides the essential materials engineering solutions used to fabricate virtually every chip on the planet. A 30% growth target suggests that the industry is not merely experiencing a temporary spike in demand, but a fundamental restructuring of global fabrication capacity. This growth is likely driven by the transition to more advanced process nodes (2nm and beyond) and the integration of new materials required for AI-specific silicon.

The Critical Role of High Bandwidth Memory (HBM)

Onto Innovation's securing of a $240 million purchase agreement for High Bandwidth Memory (HBM) tools through 2027 highlights a specific technical bottleneck in AI hardware: memory bandwidth. AI accelerators, such as those produced by NVIDIA and AMD, require massive amounts of data to move quickly between the processor and memory to avoid "memory wall" latency. HBM involves stacking DRAM dies vertically, a process that requires extreme precision in metrology and inspection. ONTO's deal underscores the industry's desperate need for specialized inspection tools to ensure the yield of these complex 3D-stacked structures, making them a primary beneficiary of the AI memory boom.

Teradyne and the Quality Assurance Bottleneck

While fabrication and memory are critical, the final stage of the semiconductor lifecycle—testing—is where Teradyne operates. As AI chips become more complex and incorporate heterogeneous integration (mixing different types of chips in one package), the testing phase becomes exponentially more difficult. Teradyne's role in the ecosystem is to ensure that these high-cost AI chips are functional before they are deployed in data centers. The mention of Teradyne's Q1 revenue performance suggests that the demand for sophisticated automated test equipment (ATE) is scaling in tandem with the volume of AI silicon entering the market.

The Broader Ecosystem: From Fabs to Data Centers

When viewed collectively, these three companies represent the entire vertical stack of semiconductor manufacturing: AMAT provides the tools to build the wafers, ONTO ensures the precision of the memory stacks, and Teradyne verifies the final product. This interconnected growth indicates a holistic expansion of the AI supply chain. This trend is further amplified by geopolitical initiatives, such as the U.S. CHIPS Act and similar efforts in Europe and Asia, which encourage the construction of domestic fabs to ensure AI sovereignty. The "spending wave" is therefore a combination of commercial demand for AI compute and strategic government investment in hardware resilience.

Future Outlook and Market Implications

Looking forward, the semiconductor equipment market is likely to remain in a high-growth phase as the industry moves toward "AI PCs" and "AI Smartphones," which will move AI processing from the cloud to the edge. This will require a new generation of chips with integrated AI accelerators, further driving the need for the equipment provided by AMAT, ONTO, and Teradyne. We can expect a continued trend of high capital expenditure (CapEx) as hyperscalers (Google, Microsoft, AWS) push for more efficient and powerful silicon to lower the cost of training and running the next generation of AI models.

Summary

The coordinated growth across AMAT, ONTO, and Teradyne confirms that the AI boom has moved beyond the speculative phase and into a massive industrial build-out. With growth forecasts extending to 2026 and 2027, the semiconductor equipment sector is positioned as the foundational layer of the AI economy, turning the theoretical potential of AI into physical, scalable hardware.

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